多層フレキシブルプリント回路(FPC)の世界市場動向・分析2018-2025

QYResearchが発行した調査報告書(QYR8D06890)
◆英語タイトル:Global Multi-layer Flexible Printed Circuit (FPC) Industry Research Report, Growth Trends and Competitive Analysis 2018-2025
◆商品コード:QYR8D06890
◆発行会社(リサーチ会社):QYResearch
◆発行日:2018年12月4日
◆ページ数:120
◆レポート形式:英語 / PDF
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◆調査対象地域:グローバル、世界主要国
◆産業分野:電子
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本調査レポートは、多層フレキシブルプリント回路(FPC)の世界市場について調査・分析し、種類別には、接着剤なし回路、接着剤なし回路に、用途別には、家電、自動車、航空宇宙・防衛/軍、医療、その他に区分してまとめました。調査対象企業は、Nippon Mektron、AKM、Yamashita Materials Corporation、ZDT、QualiEco Circuits、MFS Technology、Yamaichi Electronics、CMD Circuits、Fujikura、Interflex、MFLEX、Flexium、CAREER、SIFLEX、Taiyo Industries、Daeduck GDS、BHflex、Sumitomo Electric Group、Tech-Etch等です。

・レポートの概要
・グローバル成長トレンド
・多層フレキシブルプリント回路(FPC)の世界市場規模
・多層フレキシブルプリント回路(FPC)の地域別市場規模
・グローバル産業動向
・企業別市場シェア
・企業別多層フレキシブルプリント回路(FPC)の価格動向
・多層フレキシブルプリント回路(FPC)の種類別市場規模(接着剤なし回路、接着剤なし回路)
・多層フレキシブルプリント回路(FPC)の用途別市場規模(家電、自動車、航空宇宙・防衛/軍、医療、その他)
・多層フレキシブルプリント回路(FPC)の北米市場(アメリカ、カナダ、メキシコ)
・多層フレキシブルプリント回路(FPC)のヨーロッパ市場(ドイツ、フランス、イギリス、イタリア、ロシア)
・多層フレキシブルプリント回路(FPC)のアジア市場(日本、中国、韓国、インド、オーストラリア、インドネシア、タイ、マレーシア、フィリピン、ベトナム)
・多層フレキシブルプリント回路(FPC)の中南米市場(ブラジル等)
・多層フレキシブルプリント回路(FPC)の中東・アフリカ市場(GCC、エジプト、南アフリカ)
・主要企業情報(Nippon Mektron、AKM、Yamashita Materials Corporation、ZDT、QualiEco Circuits、MFS Technology、Yamaichi Electronics、CMD Circuits、Fujikura、Interflex、MFLEX、Flexium、CAREER、SIFLEX、Taiyo Industries、Daeduck GDS、BHflex、Sumitomo Electric Group、Tech-Etch)
 -企業概要、事業概要、販売・売上・市場シェア、XXX製品概要、企業動向
・バリューチェーン及び販売チャネル分析
・多層フレキシブルプリント回路(FPC)の市場規模予測
・多層フレキシブルプリント回路(FPC)の種類別市場予測2018-2025(接着剤なし回路、接着剤なし回路)
・多層フレキシブルプリント回路(FPC)の用途別市場予測2018-2025(家電、自動車、航空宇宙・防衛/軍、医療、その他)
・多層フレキシブルプリント回路(FPC)の北米市場予測2018-2025(アメリカ、カナダ、メキシコ)
・多層フレキシブルプリント回路(FPC)のヨーロッパ市場予測2018-2025(ドイツ、フランス、イギリス、イタリア、ロシア)
・多層フレキシブルプリント回路(FPC)のアジア市場予測2018-2025(日本、中国、韓国、インド、オーストラリア、インドネシア、タイ、マレーシア、フィリピン、ベトナム)
・多層フレキシブルプリント回路(FPC)の中南米市場予測2018-2025(ブラジル等)
・多層フレキシブルプリント回路(FPC)の中東・アフリカ市場予測2018-2025(GCC、エジプト、南アフリカ)
・調査結果及び結論
【レポートの概要】

The Multi-layer Flexible Printed Circuit (FPC) market was valued at xx Million US$ in 2017 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Multi-layer Flexible Printed Circuit (FPC).
This study focuses on the production side and consumption side of Multi-layer Flexible Printed Circuit (FPC), presents the global Multi-layer Flexible Printed Circuit (FPC) market size by manufacturers, regions, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.
In terms of production side, this report researches the Multi-layer Flexible Printed Circuit (FPC) capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.
In terms of consumption side, this report focuses on the consumption of Multi-layer Flexible Printed Circuit (FPC) by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

This report includes the following manufacturers; we can also add the other companies as you want.
Nippon Mektron
AKM
Yamashita Materials Corporation
ZDT
QualiEco Circuits
MFS Technology
Yamaichi Electronics
CMD Circuits
Fujikura
Interflex
MFLEX
Flexium
CAREER
SIFLEX
Taiyo Industries
Daeduck GDS
BHflex
Sumitomo Electric Group
Tech-Etch

Market Segment by Product Type
Circuit with Adhesive
Circuit without Adhesive

Market Segment by Application
Consumer Electronics
Automotive
Aerospace and Defense/Military
Medical
Others

Key Regions split in this report:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Central & South America
Brazil
Rest of Central & South America
Middle East & Africa

The study objectives are:
To analyze and research the global Multi-layer Flexible Printed Circuit (FPC) status and future forecast, involving capacity, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
To present the key Multi-layer Flexible Printed Circuit (FPC) manufacturers, capacity, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Multi-layer Flexible Printed Circuit (FPC) are as follows:
History Year: 2013-2018
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025

【レポートの目次】

Table of Contents

1 Report Overview
1.1 Research Scope
1.2 Major Manufacturers Covered in This Report
1.3 Market Segment by Type
1.3.1 Global Multi-layer Flexible Printed Circuit (FPC) Market Size Growth Rate by Type
1.3.2 Circuit with Adhesive
1.3.3 Circuit without Adhesive
1.4 Market Segment by Application
1.4.1 Global Multi-layer Flexible Printed Circuit (FPC) Market Share by Application (2018-2025)
1.4.2 Consumer Electronics
1.4.3 Automotive
1.4.4 Aerospace and Defense/Military
1.4.5 Medical
1.4.6 Others
1.5 Study Objectives
1.6 Years Considered

2 Global Growth Trends
2.1 Production and Capacity Analysis
2.1.1 Global Multi-layer Flexible Printed Circuit (FPC) Production Value 2013-2025
2.1.2 Global Multi-layer Flexible Printed Circuit (FPC) Production 2013-2025
2.1.3 Global Multi-layer Flexible Printed Circuit (FPC) Capacity 2013-2025
2.1.4 Global Multi-layer Flexible Printed Circuit (FPC) Marketing Pricing and Trends
2.2 Key Producers Growth Rate (CAGR) 2018-2025
2.2.1 Global Multi-layer Flexible Printed Circuit (FPC) Market Size CAGR of Key Regions
2.2.2 Global Multi-layer Flexible Printed Circuit (FPC) Market Share of Key Regions
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers

3 Market Share by Manufacturers
3.1 Capacity and Production by Manufacturers
3.1.1 Global Multi-layer Flexible Printed Circuit (FPC) Capacity by Manufacturers
3.1.2 Global Multi-layer Flexible Printed Circuit (FPC) Production by Manufacturers
3.2 Revenue by Manufacturers
3.2.1 Multi-layer Flexible Printed Circuit (FPC) Revenue by Manufacturers (2013-2018)
3.2.2 Multi-layer Flexible Printed Circuit (FPC) Revenue Share by Manufacturers (2013-2018)
3.2.3 Global Multi-layer Flexible Printed Circuit (FPC) Market Concentration Ratio (CR5 and HHI)
3.3 Multi-layer Flexible Printed Circuit (FPC) Price by Manufacturers
3.4 Key Manufacturers Multi-layer Flexible Printed Circuit (FPC) Plants/Factories Distribution and Area Served
3.5 Date of Key Manufacturers Enter into Multi-layer Flexible Printed Circuit (FPC) Market
3.6 Key Manufacturers Multi-layer Flexible Printed Circuit (FPC) Product Offered
3.7 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type
4.1 Production and Production Value for Each Type
4.1.1 Circuit with Adhesive Production and Production Value (2013-2018)
4.1.2 Circuit without Adhesive Production and Production Value (2013-2018)
4.2 Global Multi-layer Flexible Printed Circuit (FPC) Production Market Share by Type
4.3 Global Multi-layer Flexible Printed Circuit (FPC) Production Value Market Share by Type
4.4 Multi-layer Flexible Printed Circuit (FPC) Ex-factory Price by Type

5 Market Size by Application
5.1 Overview
5.2 Global Multi-layer Flexible Printed Circuit (FPC) Consumption by Application

6 Production by Regions
6.1 Global Multi-layer Flexible Printed Circuit (FPC) Production (History Data) by Regions 2013-2018
6.2 Global Multi-layer Flexible Printed Circuit (FPC) Production Value (History Data) by Regions
6.3 United States
6.3.1 United States Multi-layer Flexible Printed Circuit (FPC) Production Growth Rate 2013-2018
6.3.2 United States Multi-layer Flexible Printed Circuit (FPC) Production Value Growth Rate 2013-2018
6.3.3 Key Players in United States
6.3.4 United States Multi-layer Flexible Printed Circuit (FPC) Import & Export
6.4 Europe
6.4.1 Europe Multi-layer Flexible Printed Circuit (FPC) Production Growth Rate 2013-2018
6.4.2 Europe Multi-layer Flexible Printed Circuit (FPC) Production Value Growth Rate 2013-2018
6.4.3 Key Players in Europe
6.4.4 Europe Multi-layer Flexible Printed Circuit (FPC) Import & Export
6.5 China
6.5.3 Key Players in China
6.5.2 China Multi-layer Flexible Printed Circuit (FPC) Production Value Growth Rate 2013-2018
6.5.3 Key Players in China
6.5.4 China Multi-layer Flexible Printed Circuit (FPC) Import & Export
6.6 Japan
6.6.1 Japan Multi-layer Flexible Printed Circuit (FPC) Production Growth Rate 2013-2018
6.6.2 Japan Multi-layer Flexible Printed Circuit (FPC) Production Value Growth Rate 2013-2018
6.6.3 Key Players in Japan
6.6.4 Japan Multi-layer Flexible Printed Circuit (FPC) Import & Export
6.7 Other Regions
6.7.1 South Korea
6.7.2 India
6.7.3 Southeast Asia

7 Multi-layer Flexible Printed Circuit (FPC) Consumption by Regions
7.1 Global Multi-layer Flexible Printed Circuit (FPC) Consumption (History Data) by Regions
7.2 North America
7.2.1 North America Multi-layer Flexible Printed Circuit (FPC) Consumption by Type
7.2.2 North America Multi-layer Flexible Printed Circuit (FPC) Consumption by Application
7.2.3 North America Multi-layer Flexible Printed Circuit (FPC) Consumption by Countries
7.2.4 United States
7.2.5 Canada
7.2.6 Mexico
7.3 Europe
7.3.1 Europe Multi-layer Flexible Printed Circuit (FPC) Consumption by Type
7.3.2 Europe Multi-layer Flexible Printed Circuit (FPC) Consumption by Application
7.3.3 Europe Multi-layer Flexible Printed Circuit (FPC) Consumption by Countries
7.3.4 Germany
7.3.5 France
7.3.6 UK
7.3.7 Italy
7.3.8 Russia
7.4 Asia Pacific
7.4.1 Asia Pacific Multi-layer Flexible Printed Circuit (FPC) Consumption by Type
7.4.2 Asia Pacific Multi-layer Flexible Printed Circuit (FPC) Consumption by Application
7.4.3 Asia Pacific Multi-layer Flexible Printed Circuit (FPC) Consumption by Countries
7.4.4 China
7.4.5 Japan
7.4.6 Korea
7.4.7 India
7.4.8 Australia
7.4.9 Indonesia
7.4.10 Thailand
7.4.11 Malaysia
7.4.12 Philippines
7.4.13 Vietnam
7.5 Central & South America
7.5.1 Central & South America Multi-layer Flexible Printed Circuit (FPC) Consumption by Type
7.5.2 Central & South America Multi-layer Flexible Printed Circuit (FPC) Consumption by Application
7.5.3 Central & South America Multi-layer Flexible Printed Circuit (FPC) Consumption by Countries
7.5.4 Brazil
7.6 Middle East and Africa
7.6.1 Middle East and Africa Multi-layer Flexible Printed Circuit (FPC) Consumption by Type
7.6.2 Middle East and Africa Multi-layer Flexible Printed Circuit (FPC) Consumption by Application

8 Company Profiles
8.1 Nippon Mektron
8.1.1 Nippon Mektron Company Details
8.1.2 Company Description and Business Overview
8.1.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.1.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.1.5 Nippon Mektron Recent Development
8.2 AKM
8.2.1 AKM Company Details
8.2.2 Company Description and Business Overview
8.2.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.2.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.2.5 AKM Recent Development
8.3 Yamashita Materials Corporation
8.3.1 Yamashita Materials Corporation Company Details
8.3.2 Company Description and Business Overview
8.3.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.3.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.3.5 Yamashita Materials Corporation Recent Development
8.4 ZDT
8.4.1 ZDT Company Details
8.4.2 Company Description and Business Overview
8.4.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.4.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.4.5 ZDT Recent Development
8.5 QualiEco Circuits
8.5.1 QualiEco Circuits Company Details
8.5.2 Company Description and Business Overview
8.5.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.5.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.5.5 QualiEco Circuits Recent Development
8.6 MFS Technology
8.6.1 MFS Technology Company Details
8.6.2 Company Description and Business Overview
8.6.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.6.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.6.5 MFS Technology Recent Development
8.7 Yamaichi Electronics
8.7.1 Yamaichi Electronics Company Details
8.7.2 Company Description and Business Overview
8.7.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.7.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.7.5 Yamaichi Electronics Recent Development
8.8 CMD Circuits
8.8.1 CMD Circuits Company Details
8.8.2 Company Description and Business Overview
8.8.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.8.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.8.5 CMD Circuits Recent Development
8.9 Fujikura
8.9.1 Fujikura Company Details
8.9.2 Company Description and Business Overview
8.9.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.9.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.9.5 Fujikura Recent Development
8.10 Interflex
8.10.1 Interflex Company Details
8.10.2 Company Description and Business Overview
8.10.3 Production and Revenue of Multi-layer Flexible Printed Circuit (FPC)
8.10.4 Multi-layer Flexible Printed Circuit (FPC) Product Introduction
8.10.5 Interflex Recent Development
8.11 MFLEX
8.12 Flexium
8.13 CAREER
8.14 SIFLEX
8.15 Taiyo Industries
8.16 Daeduck GDS
8.17 BHflex
8.18 Sumitomo Electric Group
8.19 Tech-Etch

9 Market Forecast: Production Side
9.1 Production and Production Value Forecast
9.1.1 Global Multi-layer Flexible Printed Circuit (FPC) Capacity, Production Forecast 2018-2025
9.1.2 Global Multi-layer Flexible Printed Circuit (FPC) Production Value Forecast 2018-2025
9.2 Multi-layer Flexible Printed Circuit (FPC) Production and Production Value Forecast by Regions
9.2.1 Global Multi-layer Flexible Printed Circuit (FPC) Production Value Forecast by Regions
9.2.2 Global Multi-layer Flexible Printed Circuit (FPC) Production Forecast by Regions
9.3 Multi-layer Flexible Printed Circuit (FPC) Key Producers Forecast
9.3.1 United States
9.3.2 Europe
9.3.3 China
9.3.4 Japan
9.3.5 Other Regions
9.4 Forecast by Type
9.4.1 Global Multi-layer Flexible Printed Circuit (FPC) Production Forecast by Type
9.4.2 Global Multi-layer Flexible Printed Circuit (FPC) Production Value Forecast by Type

10 Market Forecast: Consumption Side
10.1 Consumption Forecast by Application
10.2 Multi-layer Flexible Printed Circuit (FPC) Consumption Forecast by Regions
10.3 North America Market Consumption Forecast
10.3.1 North America Multi-layer Flexible Printed Circuit (FPC) Consumption Forecast by Countries 2018-2025
10.3.2 United States
10.3.3 Canada
10.3.4 Mexico
10.4 Europe Market Consumption Forecast
10.4.1 Europe Multi-layer Flexible Printed Circuit (FPC) Consumption Forecast by Countries 2018-2025
10.4.2 Germany
10.4.3 France
10.4.4 UK
10.4.5 Italy
10.4.6 Russia
10.5 Asia Pacific Market Consumption Forecast
10.5.1 Asia Pacific Multi-layer Flexible Printed Circuit (FPC) Consumption Forecast by Countries 2018-2025
10.5.2 China
10.5.3 Japan
10.5.4 Korea
10.5.5 India
10.5.6 Australia
10.5.7 Indonesia
10.5.8 Thailand
10.5.9 Malaysia
10.5.10 Philippines
10.5.11 Vietnam
10.6 Central & South America Market Consumption Forecast
10.6.1 Central & South America Multi-layer Flexible Printed Circuit (FPC) Consumption Forecast by Country 2018-2025
10.6.2 Brazil
10.7 Middle East and Africa Market Consumption Forecast
10.7.1 Middle East and Africa Multi-layer Flexible Printed Circuit (FPC) Consumption Forecast by Countries 2018-2025
10.7.2 Middle East and Africa
10.7.3 GCC Countries
10.7.4 Egypt
10.7.5 South Africa

11 Value Chain and Sales Channels Analysis
11.1 Value Chain Analysis
11.2 Sales Channels Analysis
11.2.1 Multi-layer Flexible Printed Circuit (FPC) Sales Channels
11.2.2 Multi-layer Flexible Printed Circuit (FPC) Distributors
11.3 Multi-layer Flexible Printed Circuit (FPC) Customers

12 Opportunities & Challenges, Threat and Affecting Factors
12.1 Market Opportunities
12.2 Market Challenges
12.3 Porter’s Five Forces Analysis

13 Key Findings

14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.1.1 Research Programs/Design
14.1.1.2 Market Size Estimation
14.1.1.3 Market Breakdown and Data Triangulation
14.1.2 Data Source
14.1.2.1 Secondary Sources
14.1.2.2 Primary Sources
14.2 Author Details
14.3 Disclaimer

...

【掲載企業】

Nippon Mektron、AKM、Yamashita Materials Corporation、ZDT、QualiEco Circuits、MFS Technology、Yamaichi Electronics、CMD Circuits、Fujikura、Interflex、MFLEX、Flexium、CAREER、SIFLEX、Taiyo Industries、Daeduck GDS、BHflex、Sumitomo Electric Group、Tech-Etch

【免責事項】
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